The Extreme Ultraviolet (EUV) Lithography market share is at the forefront of semiconductor manufacturing, enabling the continued scaling of integrated circuits beyond the limits of traditional photolithography. As demand for faster, smaller, and more power-efficient chips increases—especially in fields like AI, 5G, automotive electronics, and advanced computing—EUV lithography has emerged as a transformative technology that allows chipmakers to produce devices at nodes of 7nm, 5nm, 3nm, and beyond.
market share Overview
As of 2024, the EUV lithography market share was valued at approximately USD XX billion and is projected to surpass USD XX billion by 2030, growing at a CAGR of XX%. This growth is primarily driven by the adoption of EUV systems in advanced semiconductor fabs, particularly for logic and memory chip production.
What Is EUV Lithography?
Extreme Ultraviolet Lithography uses light with a wavelength of 13.5 nanometers—much shorter than the deep ultraviolet (DUV) light traditionally used in chip manufacturing. This shorter wavelength allows for the printing of much smaller features, essential for leading-edge nodes.
Key market share Drivers
Demand for Smaller and More Powerful Chips: EUV enables higher transistor density, essential for AI, mobile, and HPC applications.
Rising R&D Investment by Foundries: Leading semiconductor manufacturers like TSMC, Samsung, and Intel are investing heavily in EUV-based processes.
Shift Toward Advanced Nodes (≤7nm): EUV becomes economically viable and essential for 5nm and 3nm production.
Support from Governments: Initiatives to strengthen domestic chip production in the U.S., EU, South Korea, and China are pushing EUV adoption.
market share Segmentation
By Equipment Type:
EUV Lithography Systems
Light Sources
Masks and Reticles
Mirrors and Optics
By Node Size:
7nm
5nm
3nm
Below 3nm
By End-Use Application:
Logic ICs (CPUs, GPUs, SoCs)
DRAM & NAND Memory
AI Processors
Automotive Chips
Mobile and Consumer Electronics
By Region:
North America
Asia-Pacific
Europe
Rest of the World
Regional Insights
Asia-Pacific (especially Taiwan and South Korea) dominates the EUV market share due to the presence of major chipmakers like TSMC and Samsung, both actively using EUV for sub-5nm nodes.
North America, led by Intel and ASML’s strong presence in the U.S., is ramping up EUV capabilities amid geopolitical shifts and supply chain concerns.
Europe is home to ASML, the sole supplier of EUV lithography systems, and plays a central role in the entire EUV value chain.
Challenges
High Cost and Complexity: An EUV system can cost over $150 million, with significant facility and operational requirements.
Supply Chain Bottlenecks: Components like mirrors and light sources are highly specialized and limited in supply.
Mask Defects and Yield Issues: Ensuring mask quality and managing stochastic defects remain technical challenges.
Key market share Players
ASML Holding N.V. – The only company manufacturing EUV lithography machines.
Intel Corporation
Taiwan Semiconductor Manufacturing Company (TSMC)
Samsung Electronics
GlobalFoundries
Canon Inc. (Exploring future EUV alternatives)
Nikon Corporation (Focusing on DUV but monitoring EUV trends)
market share Trends
High-NA EUV: ASML and partners are developing High Numerical Aperture (High-NA) EUV systems to support nodes beyond 3nm, expected to be deployed around 2025–2026.
Resist and Mask Innovation: Continued research in EUV resists, pellicles, and defect mitigation to improve process yields.
Collaborative R&D: Governments and industry stakeholders are increasingly funding EUV research to maintain leadership in semiconductor technology.
Future Outlook
The EUV lithography market share is a cornerstone of semiconductor innovation. As consumer electronics, autonomous vehicles, AI systems, and quantum computing demand exponentially more powerful chips, EUV will play a critical role in achieving Moore’s Law at advanced nodes. Despite the challenges, investments in infrastructure, research, and talent are paving the way for even more sophisticated chip manufacturing capabilities.
Conclusion
The Extreme Ultraviolet (EUV) Lithography market share represents a strategic pillar in the global semiconductor value chain. With ASML at the technological helm and leading fabs racing to master EUV processes, this market share is not only driving innovation but also becoming a key geopolitical and economic battleground. From 5nm to 2nm and beyond, EUV is unlocking the future of high-performance computing and digital transformation.
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